The Evolution and Requirements of IP for 3D Multi-Die Designs
The transition to 3D multi-die design is reshaping the semiconductor industry, enabling new levels of performance, flexibility, and innovation. However, it also introduces significant challenges for interface IP, which must be silicon-proven, customizable, and optimized for the unique requirements of 3D topologies. This white paper analyzes the drivers and trends behind 3D multi-die designs, explains why new classes of IP are required, and details the technical requirements and implications.
Synopsys is at the forefront of this transformation, offering the industry’s most comprehensive portfolio of 3D-enabled IP and AI-powered EDA flows. By partnering with Synopsys, designers can overcome the challenges of 3D multi-die designs and deliver next-generation systems with confidence.
Download Now